Silicon Roadmap · RogueWave SoC

Lattice-grade signing at edge price.

RogueWave SoC packs the 16-axis lattice, ML-DSA-65 signing, and a Hive root key into a $14.80 bill of materials. 5,000 dual-signatures per second. Designed for IoT gateways, point-of-sale terminals, and on-device agent runtimes.

What ships.

BOM cost

$14.80
per unit at 100K-unit volume
  • ARM Cortex-M33
  • Crypto co-processor
  • 16-axis sensor pack
  • Industrial-grade BGA

Throughput

5,000/s
dual-signed receipts per second
  • Ed25519 in hardware
  • ML-DSA-65 in hardware
  • Bounded jitter under 10 µs
  • Linear scale to multi-core

Power

<50 mW
active-signing power budget
  • Coin-cell viable for sensors
  • Idle < 80 µW
  • Burst-then-sleep duty cycle
  • Wide -40°C to +85°C range

Bill of materials.

Every dollar accounted for. $14.80 lands at 100K-unit volume; lower-volume runs trend toward $19 per unit.

ComponentFunctionCost
ARM Cortex-M33 MCUApplication processor, TrustZone, secure boot$4.20
Crypto co-processorEd25519 + ML-DSA-65 in hardware, true RNG$3.10
16-axis sensor packRogueWave-Lattice physical-source array$5.20
PCB & passives4-layer FR-4, decoupling, EMI shielding$2.30
Total BOM$14.80

The attestation envelope.

Every receipt produced by a RogueWave SoC carries the silicon serial, firmware version, and dual signatures. Counterparties can verify the device against the Hive root, and the firmware against the published manifest.

{ "receipt_id": "rcp_rwsoc_2c8e1f...", "soc_serial": "RW-SOC-A2-0019F4C7", "fw_version": "rwsoc-fw-1.4.2", "fw_manifest_hash": "sha256:8b2a...e093", "axis_count": 16, "sample_hex": "9f8b40eed3879030...", "ts": 1778413989.591, "sig_ed25519_b64u": "4oqQKBNgRM8EoFKAki...", "sig_mldsa65_b64u": "Sdy4QPkwR3v8H9TK...", "did": "did:hive:hivemorph", "chain": { "network": "Base", "chain_id": 8453 } }

Use cases.

IoT gateway

Field-deployed sensors that sign their own telemetry before it ever touches a network.

Retail POS

Point-of-sale terminals issuing dual-signed transaction receipts the issuer can verify offline.

Drone telemetry

Flight-state, payload, and chain-of-custody receipts that survive contested-airspace deployments.

Sovereign edge AI

On-device model-output attestation for sovereign-tier deployments where cloud signing is unacceptable.

Roadmap.

Q3 2026

Tape-out

Silicon tape-out at named foundry partner. First wafer lot expected end of quarter.

Q1 2027

Dev kits

Reserved-allocation dev kits to enrolled partners. Reference firmware open-source.

Q3 2027

Production

Volume production at $14.80 BOM tier. Industrial-grade and automotive-grade variants.

Reserve a dev kit